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Engineering (R0) Série de Livres électroniques

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  • Materials for Advanced Packaging

    Modifié par Daniel Lu, C.P. Wong ...
    Collections series Engineering (R0)
    This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer ... En savoir plus

    $267.69 CAD

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  • Electrospinning for High Performance Sensors

    Modifié par Antonella Macagnano, Emiliano Zampetti, Erich Kny ...
    Collections series Chemistry and Material Science (R0)
    This book aims to present the different aspects of electrospinning for designing and fabricating high performing materials for sensors applied in gaseous and liquid environments. Since electrospinning is a versatile and inexpensive manufacturing technology, the book emphasizes the industrial applications perspective. The volume is an edited collection of the most recent and encouraging results ... En savoir plus

    $115.29 CAD

  • Robust SRAM Designs and Analysis

    par Jawar Singh, Saraju P. Mohanty, Dhiraj K. Pradhan ...
    Collections series Engineering (R0)
    This book provides a guide to Static Random Access Memory (SRAM) bitcell design and analysis to meet the nano-regime challenges for CMOS devices and emerging devices, such as Tunnel FETs. Since process variability is an ongoing challenge in large memory arrays, this book highlights the most popular SRAM bitcell topologies (benchmark circuits) that mitigate variability, along with exhaustive ... En savoir plus

    $115.29 CAD

  • 3D Microelectronic Packaging

    From Fundamentals to Applications

    Modifié par Deepak Goyal, Yan Li ...
    Collections series Engineering (R0)
    This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, ... En savoir plus

    $217.79 CAD

  • Microstructure-Property Optimization in Metallic Glasses

    par Baran Sarac ...
    Collections series Chemistry and Material Science (R0)
    This thesis consists of an in-depth study of investigating microstructure-property relationships in bulk metallic glasses using a novel quantitative approach by which influence of the second phase features on mechanical properties can be independently and systematically analyzed. The author evaluates and optimizes the elastic and plastic deformation, as well as the overall toughness of cellular ... En savoir plus

    $115.29 CAD

  • Test and Diagnosis for Small-Delay Defects

    par Mohammad Tehranipoor, Ke Peng, Krishnendu Chakrabarty ...
    Collections series Engineering (R0)
    This book will introduce new techniques for detecting and diagnosing small-delay defects in integrated circuits. Although this sort of timing defect is commonly found in integrated circuits manufactured with nanometer technology, this will be the first book to introduce effective and scalable methodologies for screening and diagnosing small-delay defects, including important parameters such as ... En savoir plus

    $115.29 CAD

  • Nano-Bio-Sensing

    Modifié par Sandro Carrara ...
    Collections series Engineering (R0)
    The application of circuits and systems and engineering principles to problems in the medicine has led to the emergence of biomedical circuits and systems as an exciting and rapidly growing area of research. Nanotechnology provides new nano-structured materials with amazing properties. The properties offered by nanomaterials can be applied to develop advanced instrumentation for biomedical ... En savoir plus

    $115.29 CAD

  • Advanced Microsystems for Automotive Applications 2013

    Smart Systems for Safe and Green Vehicles

    Modifié par Jan Fischer-Wolfarth, Gereon Meyer ...
    Collections series Springer Nature Proceedings excluding Computer Science
    The road vehicle of the future will embrace innovations from three major automotive technology fields: driver assistance systems, vehicle networking and alternative propulsion. Smart systems such as adaptive ICT components and MEMS devices, novel network architectures, integrated sensor systems, intelligent interfaces and functional materials form the basis of these features and permit their ... En savoir plus

    $256.19 CAD

  • Carbon Nanotube Based VLSI Interconnects

    Analysis and Design

    par Brajesh Kumar Kaushik, Manoj Kumar Majumder ...
    Collections series Engineering (R0)
    The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which ... En savoir plus

    $64.09 CAD

  • The Physics of Ferromagnetism

    par Hanmin Jin, Terunobu Miyazaki ...
    Collections series Physics and Astronomy (R0)
    This book covers both basic physics of ferromagnetism, such as magnetic moment, exchange coupling, magnetic anisotropy, and recent progress in advanced ferromagnetic materials. Special focus is placed on NdFeB permanent magnets and the materials studied in the field of spintronics (explaining the development of tunnel magnetoresistance effect through the so-called giant magnetoresistance effect). ... En savoir plus

    $179.39 CAD

  • Metallic Nanostructures

    From Controlled Synthesis to Applications

    Modifié par Yujie Xiong, Xianmao Lu ...
    Collections series Chemistry and Material Science (R0)
    This book details the design for creation of metal nanomaterials with optimal functionality for specific applications. The authors describe how to make desired metal nanomaterials in a wet lab. They include an overview of applications metal nanomaterials can be implemented in and address the fundamentals in the controlled synthesis of metal nanostructures. ... En savoir plus

    $115.29 CAD

  • Photonic Packaging Sourcebook

    Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules

    par Ulrich H. P. Fischer-Hirchert ...
    Collections series Engineering (R0)
    This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current ... En savoir plus

    $140.89 CAD