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Engineering (R0) Série de Livres électroniques

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  • Variation Tolerant On-Chip Interconnects

    par Ethiopia Enideg Nigussie ...
    Collections series Engineering (R0)
    This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next ... En savoir plus

    $115.99 CAD

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  • Robust SRAM Designs and Analysis

    par Jawar Singh, Saraju P. Mohanty, Dhiraj K. Pradhan ...
    Collections series Engineering (R0)
    This book provides a guide to Static Random Access Memory (SRAM) bitcell design and analysis to meet the nano-regime challenges for CMOS devices and emerging devices, such as Tunnel FETs. Since process variability is an ongoing challenge in large memory arrays, this book highlights the most popular SRAM bitcell topologies (benchmark circuits) that mitigate variability, along with exhaustive ... En savoir plus

    $115.99 CAD

  • Test and Diagnosis for Small-Delay Defects

    par Mohammad Tehranipoor, Ke Peng, Krishnendu Chakrabarty ...
    Collections series Engineering (R0)
    This book will introduce new techniques for detecting and diagnosing small-delay defects in integrated circuits. Although this sort of timing defect is commonly found in integrated circuits manufactured with nanometer technology, this will be the first book to introduce effective and scalable methodologies for screening and diagnosing small-delay defects, including important parameters such as ... En savoir plus

    $115.99 CAD

  • Advanced Microsystems for Automotive Applications 2013

    Smart Systems for Safe and Green Vehicles

    Modifié par Jan Fischer-Wolfarth, Gereon Meyer ...
    Collections series Springer Nature Proceedings excluding Computer Science
    The road vehicle of the future will embrace innovations from three major automotive technology fields: driver assistance systems, vehicle networking and alternative propulsion. Smart systems such as adaptive ICT components and MEMS devices, novel network architectures, integrated sensor systems, intelligent interfaces and functional materials form the basis of these features and permit their ... En savoir plus

    $256.99 CAD

  • Carbon Nanotube Based VLSI Interconnects

    Analysis and Design

    par Brajesh Kumar Kaushik, Manoj Kumar Majumder ...
    Collections series Engineering (R0)
    The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which ... En savoir plus

    $64.99 CAD

  • Nanovate

    Commercializing Disruptive Nanotechnologies

    par Mohab Anis, Ghada AlTaher, Wesam Sarhan, Mona Elsemary ...
    Collections series Engineering (R0)
    This book introduces readers from diverse backgrounds to the principles underlying nanotechnology, from devices to systems, while also describing in detail how businesses can use nanotechnology to redesign their products and processes, in order to have a clear edge over their competition. The authors include 75 case studies, describing in a highly-accessible manner, real nanotechnology innovations ... En savoir plus

    $115.99 CAD

  • Statistical Performance Analysis and Modeling Techniques for Nanometer VLSI Designs

    par Hao Yu, Ruijing Shen, Sheldon X.-D. Tan ...
    Collections series Engineering (R0)
    Since process variation and chip performance uncertainties have become more pronounced as technologies scale down into the nanometer regime, accurate and efficient modeling or characterization of variations from the device to the architecture level have become imperative for the successful design of VLSI chips.This book provides readers with tools for variation-aware design methodologies and ... En savoir plus

    $115.99 CAD

  • Shape Memory Alloy Valves

    Basics, Potentials, Design

    Modifié par Alexander Czechowicz, Sven Langbein ...
    Collections series Chemistry and Material Science (R0)
    This book introduces shape memory alloy technology with a specific focus on valve applications. The authors describe application characteristics as well the current and potential uses of this technology. They include an overview of thermal and electrical valves as well as detailed valve design strategies. ... En savoir plus

    $102.99 CAD

  • Poly-SiGe for MEMS-above-CMOS Sensors

    par Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw ...
    Collections series Engineering (R0)
    Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum ... En savoir plus

    $115.99 CAD

  • Comparators in Nanometer CMOS Technology

    par Bernhard Goll, Horst Zimmermann ...
    Collections series Engineering (R0)
    This book covers the complete spectrum of the fundamentals of clocked, regenerative comparators, their state-of-the-art, advanced CMOS technologies, innovative comparators inclusive circuit aspects, their characterization and properties. Starting from the basics of comparators and the transistor characteristics in nanometer CMOS, seven high-performance comparators developed by the authors in 120nm ... En savoir plus

    $115.99 CAD

  • 3D Microelectronic Packaging

    From Fundamentals to Applications

    Modifié par Deepak Goyal, Yan Li ...
    Collections series Engineering (R0)
    This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, ... En savoir plus

    $218.99 CAD

  • Nanotechnology and Neuroscience: Nano-electronic, Photonic and Mechanical Neuronal Interfacing

    Modifié par Massimo De Vittorio, Luigi Martiradonna, John Assad ...
    Collections series Engineering (R0)
    This book describes the use of modern micro- and nanofabrication technologies to develop improved tools for stimulating and recording electrical activity in neuronal networks. It provides an overview of the different ways in which the “nano-world” can be beneficial for neuroscientists, including improvement of mechanical adhesion of cells on electrodes, tight-sealed extracellular recordings or ... En savoir plus

    $115.99 CAD