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Showing 1 - 12 of 22 results for “john lau”
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  • Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

    by John Lau, Kuo-Ning Chiang ...
    Series series Engineering (R0)
    This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as Cu ... Read more

    $256.19 CAD

  • Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

    by John Lau, Xuejun Fan ...
    Series series Engineering (R0)
    The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates ... Read more

    $217.79 CAD

  • Semiconductor Advanced Packaging

    by John H. Lau ...
    Series series Engineering (R0)
    The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, ... Read more

    $153.69 CAD

  • Strategies for a Successful Retirement: Before, During, & After

    by John Lau ...
    Preparation is the key to success in every stage of life, from grade school to college to entering the work force to marriage, and to retirement. The level of success depends largely on how well you prepare for the journey. This book is written to help retirees strategize and make the right choices in each phase of retirement – Before, During & After.The first four chapters of the book are written ... Read more

    $5.00 CAD or Free with Kobo Plus

  • Basics Fashion Design 09: Designing Accessories

    Exploring the design and construction of bags, shoes, hats and jewellery

    by John Lau ...
    Series series Basics Fashion Design
    Long since regarded as an inessential object that simply adds to the beauty, convenience or effectiveness of an outfit, accessories are now considered key items in a fashion collection and as stand-alone pieces worthy of our undivided attention. Basics Fashion Design 09: Designing Accessories is filled with important information that any designer will need to know, examining four key items from ... Read more

    $33.79 CAD

  • Assembly and Reliability of Lead-Free Solder Joints

    by John H. Lau, Ning-Cheng Lee ...
    Series series Engineering (R0)
    This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty ... Read more

    $140.89 CAD

  • Fan-Out Wafer-Level Packaging

    by John H. Lau ...
    Series series Engineering (R0)
    This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, ... Read more

    $128.09 CAD

  • Heterogeneous Integrations

    by John H. Lau ...
    Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for ... Read more

    $192.19 CAD

  • Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

    by John H. Lau ...
    Series series Engineering (R0)
    This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, ... Read more

    $217.79 CAD

  • 3D IC Integration and Packaging

    by John H. Lau ...
    A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system ... Read more

    $227.59 CAD

  • Through-Silicon Vias for 3D Integration

    by John H. Lau ...
    A comprehensive guide to TSV and other enabling technologies for 3D integrationWritten by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low ... Read more

    $160.29 CAD

  • Chiplet Design and Heterogeneous Integration Packaging

    by John H. Lau ...
    Series series Engineering (R0)
    The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous ... Read more

    $166.49 CAD